STPS3L60S datasheet(3/4 Pages) STMICROELECTRONICS

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10 15 20 25 30 35 40 45 50 55 60

1E-3

1E-2

1E-1

1E+0

1E+1

5E+1

IR(mA)

VR(V)

Tc=25°C

Tc=75°C

Tc=100°C

Tc=125°C

Tc=150°C

Tc=50°C

Fig. 5: Reverse leakage current versus reverse

voltage applied (typical values).

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

IFM(A)

Tj=25°C

Tj=125°C

Tj=150°C

(typical values)

VFM(V)

Fig. 7-1: Forward voltage drop versus forward

current (low level, maximum values).

100

200

500

C(pF)

F=1MHz

Tj=25°C

VR(V)

Fig. 6: Junction capacitance versus reverse

voltage applied (typical values).

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

IFM(A)

VFM(V)

Tj=25°C

Tj=125°C

Tj=150°C

(typical values)

Fig. 7-2: Forward voltage drop versus forward

current (high level, maximum values).

012345

100

Rth(j-a) (°C/W)

S(Cu) (cm²)

Fig. 8: Thermal resistance junction to ambient

versus copper surface under each lead (Epoxy

printed circuit board FR4, copper thickness:

35mm)

STPS3L60S

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