STTH310 datasheet(3/5 Pages) STMICROELECTRONICS

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STTH310/S

3/5

P(W)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

(A)

F(AV)

δ=tp/T

δ = 1

δ = 0.05

δ = 0.5

δ = 0.2

δ = 0.1

Fig. 1: Conduction losses versus average current.

(A)

0.1

1.0

10.0

100.0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

T =25°C

(maximum values)

(V)

T =150°C

(maximum values)

T =150°C

(typical values)

Fig. 2: Forward voltage drop versus forward

current

Z/R

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

δ=tp/T

t (s)

Fig. 3-1: Relative variation of thermal impedance

junction ambient versus pulse duration (epoxy

FR4, Lleads = 10mm) (DO-201AD).

Z/R

th(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

δ=tp/T

t (s)

δ = 0.5

δ = 0.2

δ = 0.1

Single pulse

Fig. 3-2: Relative variation of thermal impedance

junction ambient versus pulse duration (epoxy

FR4, S=1cm

2) (SMC).

(°C/W)

th(j-a)

100

110

012

345

SMB

DO-201AD

=10mm

leads

S(cm²)

Fig. 4: Thermal resistance junction to ambient

versus copper surface under each lead (epoxy

printed circuit board FR4, copper thickness:

35µm).

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