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STW75NF30 Datasheet(PDF) 3 Page - STMicroelectronics |
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STW75NF30 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 12 page ![]() STW75NF30 Electrical ratings 3/12 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage (VGS = 0) 300 V VGS Gate-source voltage ± 20 V ID Drain current (continuous) at TC = 25 °C 60 A ID Drain current (continuous) at TC = 100 °C 37.8 A IDM (1) 1. Pulse width limited by safe operating area Drain current (pulsed) 240 A Derating factor 2.56 W/°C dv/dt(2) 2. ISD ≤ 60A, di/dt ≤ 200A/µs, VDD ≤ 80% V(BR)DSS Peak diode recovery voltage slope 12 V/ns PTOT Total dissipation at TC = 25 °C 320 W TJ Tstg Operating junction temperature Storage temperature -55 to 150 °C Table 2. Thermal resistance Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max 0.39 °C/W Rthj-amb Thermal resistance junction-ambient max 50 °C/W Tl Maximum lead temperature for soldering purpose 300 °C Table 3. Avalanche characteristics Symbol Parameter Max. value Unit IAR Avalanche current, repetitive or not-repetitive (pulse width limited by TJ max) 50 A EAS Single pulse avalanche energy (starting TJ = 25 °C, ID = IAR, VDD = 50 V) 400 mJ |
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