Document Number: 31511

For technical questions contact: ff2aresistors@vishay.com

www.vishay.com

Revision: 28-Jul-06

2

MDP 01, 03, 05

Thick Film Resistor Networks, Dual-In-Line,

Molded DIP, 01, 03, 05 Schematics

Vishay Dale

DIMENSIONS in inches [millimeters]

0.010 + 0.005

- 0.002

[0.254 + 0.127

- 0.051]

0.250

[6.35

0.310

[7.87

0.290 Min.

0.320 Nom.

0.360 Max.

[7.37 Min.

8.13 Nom.

9.14 Max.]

Pin #1

Non-Accumulative Tol.

"C" Spaces

A

0.030

[0.762] Typ.

0.100

[2.54

0.075

[1.90

0.120

[3.05

0.130 + 0.015

- 0.010

[3.30 + 0.381

- 0.254]

0.050

[1.27

0.018

[0.457

B

Pin #1

Identification

GLOBAL MODEL

A

B

C

MDP 14

0.750 [19.05]

0.600 [15.24]

6

MDP 16

0.850 [21.59]

0.700 [17.78]

7

TECHNICAL SPECIFICATIONS

PARAMETER

UNIT

MDP14

MDP16

Package Power Rating (Maximum at + 70 °C)

W

1.73

1.92

Voltage Coefficient of Resistance

< 50 ppm typical

Dielectric Strength

VAC

200

Insulation Resistance

Ω

> 10 000M minimum

Operating Temperature Range

°C

- 55 to + 125

Storage Temperature Range

°C

- 55 to + 150

MECHANICAL SPECIFICATIONS

Marking Resistance to Solvents:

Permanency testing per MIL-STD-202, Method 215

Solderability:

Per MIL-STD-202, Method 208E

Body:

Molded epoxy

Terminals:

Solder plated leads

Weight:

14 pin = 1.3 grams; 16 pin = 1.5 grams