TC3531 datasheet(2/3 Pages) TRANSCOM

2 / 3 page

TC3531

REV4_20060516

TRANSCOM, INC., 90 Dasoong 7

th Road, Tainan Science-Based Industrial Park, Shanhua Jen, Tainan County Taiwan, R.O.C.

Web-Site: www.transcominc.com.tw

Phone: 886-6-5050086

Fax: 886-6-5051602

P 2 / 2

Absolute Maximum Ratings

Symbol

Parameter/Conditions

Min.

Max.

Units

Vdd

Drain-Source Voltage

Volts

Idd

Total Drain Current

1600

RF Input Power

dBm

Power Dissipation

Tch

Operating Channel Temperature

175

°C

TSTG

Storage Temperature

-65

175

°C

Note:

This GaAs MMIC is susceptible to damage from

Electrostatic Discharge. Proper precautions should

be used when handling these devices.

Specifications subject to change without notice.

TEST CIRCUITS

Evaluation Board Schematic

EVALUATION BOARD

PCB Material: RO4003

ER = 3.38

Thickness = 20 mil

Unit: mil

* DXF file of the PCB can be downloaded from our

web-site at www.transcominc.com.tw

* Application Notes:

For better heat sinking and grounding, it's

recommended

to have the via holes beneath TC3531

filled with solder and have two screws besides TC3531

installed on the PCB area.

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