BCP69 datasheet(4/13 Pages) NXP

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BCP69_6

Product data sheet

Rev. 06 — 2 December 2008

4 of 13

NXP Semiconductors

BCP69

20 V, 1 A PNP medium power transistor

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.

[3]

Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.

(1) FR4 PCB, mounting pad for collector 6 cm2

(2) FR4 PCB, mounting pad for collector 1 cm2

(3) FR4 PCB, standard footprint

Fig 1.

Power derating curves

−65

−5

Tamb (°C)

Ptot

(W)

175

1.6

1.2

0.4

0.8

115

mle311

(1)

(2)

(3)

Table 7.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Rth(j-a)

thermal resistance from junction

to ambient

in free air

[1] -

200

K/W

[2] -

125

K/W

[3] --89

K/W

Rth(j-sp)

thermal resistance from junction

to solder point

--15

K/W

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