UBA2014_4

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 04 — 16 October 2008

16 of 19

NXP Semiconductors

UBA2014

600 V driver IV for HF fluorescent lamps

Fig 10. Package outline SOT38-1 (DIP16)

UNIT

A

max.

1

2

cE

e

L

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1

99-12-27

03-02-13

A

min.

A

max.

b

max.

w

1.40

1.14

0.055

0.045

0.53

0.38

0.32

0.23

21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.254

2.54

7.62

0.3

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7

0.51

3.7

0.15

0.021

0.015

0.013

0.009

0.01

0.1

0.02

0.19

050G09

MO-001

SC-503-16

c

(e )

1

A

L

e

D

Z

16

1

9

8

b

E

pin 1 index

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

(1)

(1)

D

(1)

Z

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1