Connecting CC2590 to a CC2520 Device

RF_P

RXTX

RF_N

RF_P

RF_N

CC2520

Alternativelyto

VDD/GND/MCU

Alternatively

fromMCU

RF_P

RXTX

RF_N

= PCBtraceinductor

CC2590

ANT

PAEN

EN

HGM

VDD

VDD

VDD

RF_P

RXTX

RF_N

R151

NC

GPIO5

GPIO4

C1

L112

C113

C111

L111

C112

C161

C101/C102

C131/C132

GPIO3

PCB Layout Guidelines

CC2590

Table 5. Control Logic for Connecting CC2590 to a CC2520 Device

PAEN

EN

RXTX

HGM

MODE OF OPERATION

0

0

NC

X

Power Down

0

1

NC

0

RX Low Gain Mode

0

1

NC

1

RX High Gain Mode

1

0

NC

X

TX

1

1

NC

X

Not allowed

Figure 13. CC2590 + CC2520 Application Circuit

The exposed die attach pad must be connected to a solid ground plane as this is the primary ground connection

for the chip. Inductance in vias to the pad should be minimized. It is highly recommended to follow the reference

layout. Changes will alter the performance. Also see the PCB landpattern information in this data sheet. For best

performance, minimize the length of the ground vias, by using a 4-layer PCB with ground plane as layer 2 when

CC2590 is mounted onto layer 1.

PCB trace inductors are used to be able to optimize the inductance value, and they are too small to be replaced

by discrete inductors. The placement of the power supply decoupling capacitors C101/C102 and C131/C132 are

important to set the PCB trace inductance values accurately.

Copyright © 2008, Texas Instruments Incorporated

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Product Folder Link(s): CC2590