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STP80NF55-08 Datasheet(PDF) 3 Page - STMicroelectronics |
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STP80NF55-08 Datasheet(HTML) 3 Page - STMicroelectronics |
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3 / 15 page ![]() STP80NF55-08 - STB80NF55-08 - STW80NF55-08 Electrical ratings 3/15 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage (VGS = 0) 55 V VGS Gate- source voltage ±20 V ID (1) 1. Current limited package Drain current (continuos) at TC = 25 °C 80 A ID (1) Drain current (continuos) at TC = 100 °C 80 A IDM (2) 2. Pulse width limited by safe operating area Drain current (pulsed) 320 A PTOT Total dissipation at TC = 25 °C 300 W Derating factor 2 W/°C Tj Tstg Operating junction temperature Storage temperature -55 to 175 °C Table 3. Thermal resistance Symbol Parameter Value Unit D2PAK TO-220 TO-247 Rthj-case Thermal resistance junction-case max 0.5 °C/W Rthj-amb Thermal resistance junction-ambient max 35(1) 1. When mounted on 1 inch2 FR-4 board, 2 oz Cu 62.5 50 °C/W Tl Maximum lead temperature for soldering purpose 300 °C Table 4. Avalanche characteristics Symbol Parameter Max value Unit IAR Avalanche current, repetitive or not-repetitive (pulse width limited by Tj max) 40 A EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 30 V) 1000 mJ |
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