7

4964B–AUTO–07/07

ATA6842

3.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating

only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this

specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Parameters

Condition

Symbol

Min.

Max.

Unit

Supply voltage

V12

–0.3

+26

V

Supply voltage

t < 500 ms

V12

–0.3

+45

V

Voltage at pins CLK, DI, E5, ERD, WDT,

WLP, CSN, RSTN, VRE, DO, C1O, C2O,

RESN, RESAN, UVR, UVW, RREF, VI,

TEST, B1CI, B1CG, B1CO, B2CI, B2CG,

B2CO, RCOS

V()

≤ V5 + 0.3V

V()

–0.3

+5.5

V

Current in pins CLK, DI, E5, ERD, WDT,

WLP, CSN, RSTN, VRE, DO, C1O, C2O,

RESN, RESAN, UVR, UVW, RREF, VI,

TEST, B1CI, B1CG, B1CO, B2CI, B2CG,

B2CO, RCOS

I()

–10

+10

mA

Voltage at RD1, RD2, RD3, RD4, WLN,

OUTN, OUTP, EK15, BSC, TCFET, UVM

V()

–0.3

+45

V

Current in RD1, RD2, RD3, RD4, WLN,

OUTN

I()

–150

+150

mA

Current in OUTP

I()

–10

+10

mA

Voltage at V5, V5A

V()

–0.3

+5.5

V

Current in V5

I()

–150

+10

mA

Current in V5A

I()

–50

+10

mA

Voltage at V12S

V()

–0.3

+45

V

Current in V12S

I()

–60

+10

mA

ESD protection at all pins

MIL-STD-883, Method 3015,

HBM 100 pF discharged

through 1.5 k

Ω

Vd()

2

kV

Junction temperature

Operation

T

j,op

–40

+150

°C

Peak

T

j,peak

–40

+165

°C

Storage temperature

T

s

–55

+125

°C

4.

Thermal Resistance

Parameters

Condition

Symbol

Min.

Max.

Unit

Operating ambient temperature range

–40

+105

°C

Thermal resistance, chip to case

10

K/W

Soldering temperature

260

°C