15

LT1055/LT1056

10556fc

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTIO

H Package

8-Lead TO-5 Metal Can (.200 Inch PCD)

(Reference LTC DWG # 05-08-1320)

N8 Package

8-Lead PDIP (Narrow .300 Inch)

(Reference LTC DWG # 05-08-1510)

0.050

(1.270)

MAX

0.016 – 0.021**

(0.406 – 0.533)

0.010 – 0.045*

(0.254 – 1.143)

SEATING

PLANE

0.040

(1.016)

MAX

0.165 – 0.185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

0.500 – 0.750

(12.700 – 19.050)

0.305 – 0.335

(7.747 – 8.509)

0.335 – 0.370

(8.509 – 9.398)

DIA

0.200

(5.080)

TYP

0.027 – 0.045

(0.686 – 1.143)

0.028 – 0.034

(0.711 – 0.864)

0.110 – 0.160

(2.794 – 4.064)

INSULATING

STANDOFF

45

°TYP

H8(TO-5) 0.200 PCD 1197

LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE

AND 0.045" BELOW THE REFERENCE PLANE

FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS

0.016 – 0.024

(0.406 – 0.610)

*

**

PIN 1

OBSOLETE PACKAGE

N8 1002

.065

(1.651)

TYP

.045 – .065

(1.143 – 1.651)

.130

± .005

(3.302

± 0.127)

.020

(0.508)

MIN

.018

± .003

(0.457

± 0.076)

.120

(3.048)

MIN

12

3

4

87

6

5

.255

± .015*

(6.477

± 0.381)

.400*

(10.160)

MAX

.008 – .015

(0.203 – 0.381)

.300 – .325

(7.620 – 8.255)

.325

+.035

–.015

+0.889

–0.381

8.255

()

NOTE:

1. DIMENSIONS ARE

INCHES

MILLIMETERS

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)

.100

(2.54)

BSC