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LT3435 Datasheet(PDF) 19 Page - Linear Technology |
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LT3435 Datasheet(HTML) 19 Page - Linear Technology |
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19 / 24 page ![]() LT3435 19 3435fa Figure 9. Power Good Figure 10. Power Good Circuits APPLICATIO S I FOR ATIO VIN PG PGFB LT3435 PG at 80% VOUT with 100ms Delay 0.27 µF COUT COUT 200k VOUT = 3.3V 153k 12k 100k FB CT VIN PG PGFB LT3435 VOUT Disconnect at 80% VOUT with 100ms Delay 0.27 µF 200k VOUT = 3.3V 153k 12k 100k FB CT VIN PG PGFB LT3435 PG at VIN > 4V with 100ms Delay 0.27 µF VOUT = 3.3V 200k 511k 200k 100k 165k FB CT VIN PG PGFB LT3435 VOUT Disconnect 3.3V Logic Signal with 100 µs Delay 270pF 200k VOUT = 12V 3435 F10 866k 100k FB CT COUT COUT threshold during normal operation, the CT pin will be discharged and PG inactive, resulting in a non Power Good cycle when SHDN is taken above its threshold. Figure 9 shows the power good operation with PGFB connected to FB and the capacitance on CT = 0.1µF. The PGOOD pin has a limited amount of drive capability and is susceptible to noise during start-up and Burst Mode operation. If erratic operation occurs during these conditions a small filter capacitor from the PGOOD pin to ground will ensure proper operation. Figure 10 shows several different con- figurations for the LT3435 Power Good circuitry. Figure 10 shows several different configurations for the LT3435 Power Good circuitry. LAYOUT CONSIDERATIONS As with all high frequency switchers, when considering layout, care must be taken in order to achieve optimal electrical, thermal and noise performance. For maximum efficiency switch rise and fall times are typically in the nanosecond range. To prevent noise both radiated and conducted the high speed switching current path, shown in Figure 11, must be kept as short as possible. This is implemented in the suggested layout of Figure 12. Short- ening this path will also reduce the parasitic trace induc- tance of approximately 25nH/inch. At switch off, this VOUT 500mV/DIV VSHDN 2V/DIV TIME (10ms/DIV) 3435 F09 PG 100k TO VIN VCT 500mV/DIV |
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