7

LTC1347

1347fa

PACKAGE DESCRIPTIO

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

G Package

28-Lead Plastic SSOP (5.3mm)

(Reference LTC DWG # 05-08-1640)

G28 SSOP 0802

0.09 – 0.25

(.0035 – .010)

0° – 8°

0.55 – 0.95

(.022 – .037)

5.00 – 5.60**

(.197 – .221)

7.40 – 8.20

(.291 – .323)

12 3

4

5

6 7 89 10 11 12

14

13

9.90 – 10.50*

(.390 – .413)

25

26

22 21 20 19 18 17 16 15

23

24

27

28

2.0

(.079)

0.05

(.002)

0.65

(.0256)

BSC

0.22 – 0.38

(.009 – .015)

MILLIMETERS

(INCHES)

DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED .152mm (.006") PER SIDE

DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE

*

**

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

0.42 ±0.03

0.65 BSC

5.3 – 5.7

7.8 – 8.2

RECOMMENDED SOLDER PAD LAYOUT

1.25 ±0.12

NW28 0502

.505 – .560*

(12.827 – 14.224)

1.455*

(36.957)

MAX

12

3

4

5

6

7

8

9

10

27

19

20

21

22

24

23

25

26

28

11

12

13

14

15

16

17

18

.009 – .015

(0.229 – 0.381)

.625

+.035

–.015

+0.889

–0.381

15.87

()

.600 – .625

(15.240 – 15.875)

.070

(1.778)

TYP

.015

(0.381)

MIN

.125

(3.175)

MIN

.150 ± .005

(3.810 ± 0.127)

.018 ± .003

(0.457 ± 0.076)

.035 – .080

(0.889 – 2.032)

.100

(2.54)

BSC

.045 – .065

(1.143 – 1.651)

NOTE:

1. DIMENSIONS ARE

INCHES

MILLIMETERS

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)

NW Package

28-Lead PDIP (Wide .600 Inch)

(Reference LTC DWG # 05-08-1520)