LTC4355



4355fa

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

package DescripTion

.016 – .050

(0.406 – 1.270)

.010 – .020

(0.254 – 0.508)

× 45°

0

° – 8° TYP

.008 – .010

(0.203 – 0.254)

1

N

2

3

4

5

6

7

8

N/2

.150 – .157

(3.810 – 3.988)

NOTE 3

16

15

14

13

.386 – .394

(9.804 – 10.008)

NOTE 3

.228 – .244

(5.791 – 6.197)

12

11

10

9

S16 0502

.053 – .069

(1.346 – 1.752)

.014 – .019

(0.355 – 0.483)

TYP

.004 – .010

(0.101 – 0.254)

.050

(1.270)

BSC

.245

MIN

N

1

2

3

N/2

.160

±.005

RECOMMENDED SOLDER PAD LAYOUT

.045

±.005

.050 BSC

.030

±.005

TYP

INCHES

(MILLIMETERS)

NOTE:

1. DIMENSIONS IN

2. DRAWING NOT TO SCALE

3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)

DE Package

14-Lead Plastic DFN (4mm × 3mm)

(Reference LTC DWG # 05-08-1708 Rev A)

S Package

16-Lead Plastic Small Outline (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1610)

3.00

±0.10

(2 SIDES)

4.00

±0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.70

± 0.10

0.75

±0.05

R = 0.115

TYP

R = 0.05

TYP

3.00 REF

1.70

± 0.05

1

7

14

8

PIN 1

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DE14) DFN 0806 REV B

PIN 1 NOTCH

R = 0.20 OR

0.35

× 45°

CHAMFER

3.00 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

2.20

±0.05

0.70

±0.05

3.60

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.25

± 0.05

0.50 BSC

3.30

±0.05

3.30

±0.10

0.50 BSC