LTC6930-X.XX

11

6930fa

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

3.00

±0.10

(2 SIDES)

2.00

±0.10

(2 SIDES)

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

0.75

±0.05

R = 0.115

TYP

R = 0.05

TYP

1.35 REF

1

4

8

5

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DCB8) DFN 0106 REV A

0.23

± 0.05

0.45 BSC

PIN 1 NOTCH

R = 0.20 OR 0.25

× 45° CHAMFER

0.25

± 0.05

1.35 REF

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

2.10

±0.05

0.70

±0.05

3.50

±0.05

PACKAGE

OUTLINE

0.45 BSC

1.35

±0.10

1.35

±0.05

1.65

± 0.10

1.65

± 0.05

MSOP (MS8) 0307 REV F

0.53

± 0.152

(.021

± .006)

SEATING

PLANE

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.18

(.007)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.1016

± 0.0508

(.004

± .002)

0.86

(.034)

REF

0.65

(.0256)

BSC

0

° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

12

3

4

4.90

± 0.152

(.193

± .006)

8

7 6 5

3.00

± 0.102

(.118

± .004)

(NOTE 3)

3.00

± 0.102

(.118

± .004)

(NOTE 4)

0.52

(.0205)

REF

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889

± 0.127

(.035

± .005)

RECOMMENDED SOLDER PAD LAYOUT

0.42

± 0.038

(.0165

± .0015)

TYP

0.65

(.0256)

BSC

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660 Rev F)

DCB Package

8-Lead Plastic DFN (2mm

× 3mm)

(Reference LTC DWG # 05-08-1718 Rev A)