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LTC1772CS6 Datasheet(PDF) 10 Page - Linear Technology |
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LTC1772CS6 Datasheet(HTML) 10 Page - Linear Technology |
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10 / 12 page ![]() 10 LTC1772 1772fb APPLICATIONS INFORMATION 0.4V, the loss increases from 0.5% to 8% as the load current increases from 0.5A to 2A. 5. Transition losses apply to the external MOSFET and increase at higher operating frequencies and input voltages. Transition losses can be estimated from: Transition Loss = 2(VIN)2IO(MAX)CRSS(f) Other losses including CIN and COUT ESR dissipative losses, and inductor core losses, generally account for less than 2% total additional loss. Foldback Current Limiting As described in the Output Diode Selection, the worst-case dissipation occurs with a short-circuited output when the diode conducts the current limit value almost continu- ously. To prevent excessive heating in the diode, foldback current limiting can be added to reduce the current in proportion to the severity of the fault. Foldback current limiting is implemented by adding diodes DFB1 and DFB2 between the output and the ITH/RUN pin as shown in Figure 5. In a hard short (VOUT = 0V), the current VFB ITH/RUN VOUT LTC1772 R1 1772 F05 R2 DFB1 DFB2 + Figure 6. LTC1772 Layout Diagram (See PC Board Layout Checklist) L1 M1 R1 BOLD LINES INDICATE HIGH CURRENT PATHS R2 D1 RSENSE VIN VOUT 1772 F06 0.1 µF COUT CITH RITH + CIN + ITH/RUN LTC1772 GND VFB 6 5 4 1 2 3 PGATE VIN SENSE– Figure 5. Foldback Current Limiting will be reduced to approximately 50% of the maximum output current. PC Board Layout Checklist When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC1772. These items are illustrated graphically in the layout diagram in Figure 6. Check the following in your layout: 1. Is the Schottky diode closely connected between ground (Pin 2) and drain of the external MOSFET? 2. Does the (+) plate of CIN connect to the sense resistor as closely as possible? This capacitor provides AC current to the MOSFET. 3. Is the input decoupling capacitor (0.1 µF) connected closely between VIN (Pin 5) and ground (Pin 2)? 4. Connect the end of RSENSE as close to VIN (Pin 5) as possible. The VIN pin is the SENSE+ of the current comparator. 5. Is the trace from SENSE– (Pin 4) to the Sense resistor kept short? Does the trace connect close to RSENSE? 6. Keep the switching node PGATE away from sensitive small signal nodes. 7. Does the VFB pin connect directly to the feedback resistors? The resistive divider R1 and R2 must be connected between the (+) plate of COUT and signal ground. |
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