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LTC1772CS6 Datasheet(PDF) 10 Page - Linear Technology

Part # LTC1772CS6
Description  Constant Frequency Current Mode Step-Down DC/DC Controller in SOT-23
PDF  12 Pages
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Manufacturer  LINER [Linear Technology]
Direct Link  http://www.linear.com
Logo LINER - Linear Technology

LTC1772CS6 Datasheet(HTML) 10 Page - Linear Technology

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LTC1772
1772fb
APPLICATIONS INFORMATION
0.4V, the loss increases from 0.5% to 8% as the load
current increases from 0.5A to 2A.
5. Transition losses apply to the external MOSFET and
increase at higher operating frequencies and input
voltages. Transition losses can be estimated from:
Transition Loss = 2(VIN)2IO(MAX)CRSS(f)
Other losses including CIN and COUT ESR dissipative
losses, and inductor core losses, generally account for
less than 2% total additional loss.
Foldback Current Limiting
As described in the Output Diode Selection, the worst-case
dissipation occurs with a short-circuited output when the
diode conducts the current limit value almost continu-
ously. To prevent excessive heating in the diode, foldback
current limiting can be added to reduce the current in
proportion to the severity of the fault.
Foldback current limiting is implemented by adding diodes
DFB1 and DFB2 between the output and the ITH/RUN pin as
shown in Figure 5. In a hard short (VOUT = 0V), the current
VFB
ITH/RUN
VOUT
LTC1772
R1
1772 F05
R2
DFB1
DFB2
+
Figure 6. LTC1772 Layout Diagram (See PC Board Layout Checklist)
L1
M1
R1
BOLD LINES INDICATE HIGH CURRENT PATHS
R2
D1
RSENSE
VIN
VOUT
1772 F06
0.1
µF
COUT
CITH
RITH
+
CIN
+
ITH/RUN
LTC1772
GND
VFB
6
5
4
1
2
3
PGATE
VIN
SENSE–
Figure 5. Foldback Current Limiting
will be reduced to approximately 50% of the maximum
output current.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC1772. These items are illustrated graphically in the
layout diagram in Figure 6. Check the following in your
layout:
1. Is the Schottky diode closely connected between ground
(Pin 2) and drain of the external MOSFET?
2. Does the (+) plate of CIN connect to the sense resistor
as closely as possible? This capacitor provides AC
current to the MOSFET.
3. Is the input decoupling capacitor (0.1
µF) connected
closely between VIN (Pin 5) and ground (Pin 2)?
4. Connect the end of RSENSE as close to VIN (Pin 5) as
possible. The VIN pin is the SENSE+ of the current
comparator.
5. Is the trace from SENSE– (Pin 4) to the Sense resistor
kept short? Does the trace connect close to RSENSE?
6. Keep the switching node PGATE away from sensitive
small signal nodes.
7. Does the VFB pin connect directly to the feedback
resistors? The resistive divider R1 and R2 must be
connected between the (+) plate of COUT and signal
ground.



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