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AOTF12N60 Datasheet(PDF) 2 Page - Alpha & Omega Semiconductors |
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AOTF12N60 Datasheet(HTML) 2 Page - Alpha & Omega Semiconductors |
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2 / 6 page ![]() AOT12N60 / AOTF12N60 Symbol Min Typ Max Units 600 V 700 V BVDSS /∆TJ 0.65 V/ oC 1 10 IGSS ±100 nA VGS(th) 345 V RDS(ON) 0.46 0.55 Ω gFS 20 S VSD 0.72 1 V IS 12 A ISM 48 A Ciss 1400 1751 2100 pF Coss 130 164 200 pF Crss 10 13 16 pF Rg 2.5 3.3 5 Ω Qg 40.5 50 nC Qgs 8.7 11 nC Qgd 17.9 22 nC tD(on) 39 50 ns tr 70 85 ns tD(off) 122 150 ns tf 74 90 ns trr 311 373 ns Qrr 5.2 6.2 µC 50 THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Body Diode Reverse Recovery Charge IF=12A,dI/dt=100A/µs,VDS=100V Maximum Body-Diode Continuous Current Input Capacitance Output Capacitance Turn-On DelayTime DYNAMIC PARAMETERS Turn-On Rise Time Turn-Off DelayTime VGS=10V, VDS=300V, ID=12A, RG=25Ω Total Gate Charge VGS=10V, VDS=480V, ID=12A Gate Source Charge Gate Drain Charge Electrical Characteristics (TJ=25°C unless otherwise noted) STATIC PARAMETERS Parameter Conditions ID=250µA, VGS=0V, TJ=25°C VGS=10V, ID=6A Reverse Transfer Capacitance IF=12A,dI/dt=100A/µs,VDS=100V VGS=0V, VDS=25V, f=1MHz SWITCHING PARAMETERS IDSS µA Static Drain-Source On-Resistance Forward Transconductance VDS=0V, VGS=±30V Zero Gate Voltage Drain Current Gate-Body leakage current Body Diode Reverse Recovery Time Diode Forward Voltage IS=1A, VGS=0V VDS=40V, ID=6A Gate resistance VGS=0V, VDS=0V, f=1MHz Turn-Off Fall Time BVDSS Drain-Source Breakdown Voltage ID=250µA, VGS=0V, TJ=150°C Maximum Body-Diode Pulsed Current VDS=480V, TJ=125°C Breakdown Voltage Temperature Coefficient ID=250µA, VGS=0V Gate Threshold Voltage VDS=VGS, ID=250µA VDS=600V, VGS=0V A: The value of R θJA is measured with the device in a still air environment with T A =25°C. B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150°C. G. L=60mH, IAS=5.5A, VDD=50V, RG=25Ω, Starting TJ=25°C Rev 0. July 2008 Alpha & Omega Semiconductor, Ltd. www.aosmd.com |
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