SN54ABT574, SN74ABT574A

OCTAL EDGETRIGGERED DTYPE FLIPFLOPS

WITH 3STATE OUTPUTS

SCBS191F − JANUARY 1991 − REVISED SEPTEMBER 2003

3

POST OFFICE BOX 655303

−0.5 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−0.5 V to 7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−0.5 V to 5.5 V

. . . . . . . . . . . . . . . . . . .

96 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SN74ABT574A

128 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−18 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

70

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 2): DW package

58

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 2): GQN/ZQN package

78

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 2): N package

69

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 2): NS package

60

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 2): PW package

83

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 3): RGY package

37

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

3. The package thermal impedance is calculated in accordance with JESD 51-5.

recommended operating conditions (see Note 4)

SN54ABT574

SN74ABT574A

UNIT

MIN

MAX

MIN

MAX

UNIT

VCC

Supply voltage

4.5

5.5

4.5

5.5

V

VIH

High-level input voltage

2

2

V

VIL

Low-level input voltage

0.8

0.8

V

VI

Input voltage

0

VCC

0

VCC

V

IOH

High-level output current

−24

−32

mA

IOL

Low-level output current

48

64

mA

∆t/∆v

Input transition rise or fall rate

Outputs enabled

5

5

ns/V

TA

Operating free-air temperature

−55

125

−40

85

°C

NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.