The surface mount versions of the HPR1XXWC series are designed for SMT reflow soldering.

During this standard process devices should be heated at a rate not to exceed 3 degrees C per

second. The peak reflow temperature is 260 degrees C. The device should not be exposed to the

peak temperature ±10 degrees C for more than 12 seconds. The cool down rate for this device

should not exceed 3 degrees C per second.

SOLDERING INFORMATION

SPECIFICATIONS, ALL MODELS

Specifications are at T

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

INPUT

Voltage Range

4.5

5

5.5

VDC

10.8

12

13.2

VDC

13.5

15

16.5

VDC

21.6

24

26.4

VDC

Voltage Rise Time See Typical Performance Curves & Application Notes: “Capacitive Loading Effects on Start-Up of DC/DC Converters”

OUTPUT

Rated Power

750

mW

Voltage Setpoint Accuracy

Rated Load, Nominal V

IN

±5

%

Ripple & Noise

BW = DC to 10MHz

150

200

mVp-p

BW =10Hz to 2MHz

30

40

mVrms

Voltage (Over Input Voltage Range) 1mAto Rated Current, V

5V

4.75

7

VDC

1mAto Rated Current, V

11.40

15

VDC

1mAto Rated Current, V

14.25

18

VDC

Temperature Coefficent

.01

.05

%/ °C

REGULATION

Load Regulation (All other modes)

Rated Load to 1mA Load

3

%

GENERAL

ISOLATION

Rated Voltage

750

VDC

Test Voltage

60 Hz, 10 Seconds

750

Vrms

Resistance

10

G

Ω

Capacitance

25

100

pF

Leakage Current

V

2

8.5

μArms

Switching Frequency

170

kHz

Frequency Change

Over Line and Load

24

%

Package Weight

3

g

MTTF per MIL-HDBK-217, Rev. F*

Circuit Stress Method

Ground Benign

T

7.9

MHr

Fixed Ground

T

1.9

MHr

Naval Sheltered

T

1.2

MHr

Airborne Uninhabited Fighter

T

300

kHr

Moisture Sensitivity Level (MSL)

IPC/JEDEC J-STD-20

2

TEMPERATURE

Specification

-25

+25

+85

°C

Operation

-40

+100

°C

Storage

-40

+110

°C

TDC_HPR1xxWC.B01 Page 2 of 4

www.murata-ps.com

HPR1XXWC Series

0.75 Watt Single Output DC/DC Converter