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MDS726 Datasheet(PDF) 1 Page - Zentrum Mikroelektronik Dresden AG |
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MDS726 Datasheet(HTML) 1 Page - Zentrum Mikroelektronik Dresden AG |
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1 / 1 page ![]() ZMD-Standard January 2005 Supersedes Edition 11.95 Package SOP8 (150 mil) MDS 726 Zentrum Mikroelektronik Dresden Editor: signature by Schoder Date: 06.01.2005 Doc-No. QS-000726-HD-03 Check: signature by Marx Quality: signature by Tina Kochan Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten. Proprietary data, company confidential. All rights reserved. Dimensions in millimetres Based on IEC 191-2Q: Type 076E35 B 1Dimensions Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,95 Amin 1,55 bPmin 0,35 A1min 0,10 bPmax 0,49 A1max 0,30 enom 1,27 A2min 1,40 HEmin 5,80 A2max 1,80 HEmax 6,30 cmin 0,15 LPmin 0,40 cmax 0,25 Zmax 0,635 Dmin*4,80 Dmax*5,00 2Weight ≤ 0,3 g Emin*3,80 3 Package Body Material Low Stress Epoxy Emax*4,00 4Lead Material FeNi-Alloy or Cu-Alloy kmin 0,33 5Lead Finish solder plating θmin 0° 6Lead Form Z-bends θmax 8° * without mold-flash View X LP k x 45 ° Z 0,1 X e D 1 8 b M 0,2 |
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