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MDS752 Datasheet(PDF) 1 Page - Zentrum Mikroelektronik Dresden AG |
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MDS752 Datasheet(HTML) 1 Page - Zentrum Mikroelektronik Dresden AG |
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1 / 1 page ![]() ZMD-Standard March 1998 Package SOP16 (150 mil) MDS 752 Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 30.03.1998 Doc-No. QS-000752-HD-01 Check: signed Marx Quality: signed Lorenz Dimensions in millimetres Based on IEC 191-2Q: Type 076E07S 1Dimensions Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,73 Amin 1,55 bPmin 0,35 A1min 0,127 bPmax 0,49 A1max 0,25 enom 1,27 A2min 1,40 HEmin 5,80 A2max 1,55 HEmax 6,30 cmin 0,19 LPmin 0,40 cmax 0,25 Zmax 0,55 Dmin*9,80 Dmax*9,98 2Weight £ 0,5 g Emin*3,80 3 Package Body Material Low Stress Epoxy Emax*4,00 4Lead Material FeNi-Alloy or Cu-Alloy kmin 0,25 5Lead Finish solder plating qmin 0° 6Lead Form Z-bends qmax 8° * without mold-flash View X LP k x 45 ° Z 0,1 X e D 1 16 b M 0,2 |
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