MDS757 datasheet(1/1 Pages) ZMD

Part #	MDS757

Description	Package SSOP20

PDF	1 Pages

Scroll/Zoom	100%

Manufacturer	ZMD [Zentrum Mikroelektronik Dresden AG]

Direct Link	http://www.zmdi.com

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1 / 1 page

ZMD-Standard

February 2000

Supersedes

Edition 11.99

Package SSOP20

(5,3 mm)

MDS

757

Zentrum Mikroelektronik Dresden AG

Editor: signed Schoder

Date: 16.02.2000

Doc-No.

QS-000757-HD-02

Check: signed Marx

Quality: signed Lorenz

Dimensions in millimetres

Based on JEDEC JEP95: MO-150

1Dimensions

Dimensions of Sub-Group B1

Dimensions of Sub-Group C1

Amax

1,99

Amin

1,73

bPmin

0,25

A1min

0,05

bPmax

0,38

A1max

0,21

enom

0,65

A2min

1,68

HEmin

7,65

A2max

1,78

HEmax

7,90

cmin

0,09

LPmin

0,63

cmax

0,20

Zmax

0,74

Dmin*7,07

Dmax*7,33

2Weight

 0,3 g

Emin*5,20

3 Package Body Material

Low Stress Epoxy

Emax*5,38

4Lead Material

FeNi-Alloy or Cu-Alloy

kmin

0,25

5Lead Finish

solder plating

°min

0°

6Lead Form

Z-bends

°max

10°

* without mold-flash

k x 45°

View X

Lp

Z

0,1

X

bp

e

M

0,15

D

1

20

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MDS757 Datasheet(PDF) 1 Page - Zentrum Mikroelektronik Dresden AG

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