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MDS764 Datasheet(PDF) 1 Page - Zentrum Mikroelektronik Dresden AG |
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MDS764 Datasheet(HTML) 1 Page - Zentrum Mikroelektronik Dresden AG |
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1 / 1 page ![]() ZMD-Standard September 2002 Package TSOP (ll) 44 (400 mil) MDS 764 Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 18.09.2002 Doc-No. QS-000764-HD-01 Check: signed Marx Quality: signed Kochan Dimensions in millimetres Based on JEDEC: JEP95 MO-133 1Dimensions Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,20 Amin - bPmin 0,30 A1min 0,05 bPmax 0,45 A1max 0,15 enom 0,80 A2min 0,95 HEmin 11,56 A2max 1,05 HEmax 11,96 cmin 0,12 LPmin 0,40 cmax 0,21 Dmin* 18,28 2Weight £ 0,3 g Dmax* 18,54 3 Package Body Material Low Stress Epoxy Emin* 10,03 4Lead Material FeNi-Alloy or Cu-Alloy Emax* 10,29 5Lead Finish solder plating qmin 0° 6Lead Form Z-bends qmax 5° * without mold-flash D e 1 44 bp A2 A 0,1 M Detail Z LP |
Similar Part No. - MDS764 |
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Similar Description - MDS764 |
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