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SN74ALS2240 Datasheet(PDF) 2 Page - Texas Instruments

Part # SN74ALS2240
Description  OCTAL BUFFER AND LINE DRIVER/MOS DRIVER WITH 3-STATE OUTPUTS
PDF  5 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

SN74ALS2240 Datasheet(HTML) 2 Page - Texas Instruments

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SN74ALS2240
OCTAL BUFFER AND LINE DRIVER/MOS DRIVER
WITH 3-STATE OUTPUTS
SDAS268A – DECEMBER 1994 – REVISED NOVEMBER 1997
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
logic diagram (positive logic)†
1
2
4
6
8
19
11
13
15
17
3
5
7
9
12
14
16
18
1A1
1A2
1A3
1A4
1Y1
2A1
2A2
2A3
2A4
2Y1
1Y2
1Y3
1Y4
2Y2
2Y3
2Y4
1OE
2OE
† All output resistors are 25
Ω.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage, VCC
7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI: All inputs
7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I/O ports
5.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA
0
°C to 70°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
–65
°C to 70°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Note 1): DW package
97
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package
67
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51, except for through hole packages, which use a trace length
of zero.



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