THS6022

250-mA DUAL DIFFERENTIAL LINE DRIVER

SLOS225C – SEPTEMBER 1998 – REVISED JANUARY 2000

2

POST OFFICE BOX 655303

description (continued)

The THS6022 is packaged in the patented PowerPAD package. This package provides outstanding thermal

characteristics in a small footprint package, which is fully compatible with automated surface-mount assembly

procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By simply

soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from the

junction.

AVAILABLE OPTIONS

PACKAGED DEVICE

TA

PowerPAD PLASTIC

SMALL OUTLINE†

(PWP)

MicroStar Junior

(GQE)

EVALUATION

MODULE

0

°C to 70°C

THS6022CPWP

THS6022CGQE

THS6022EVM

–40

°C to 85°C

THS6022IPWP

THS6022IGQE

—

† The PWP packages are available taped and reeled. Add an R suffix to the device type (i.e.,

THS6022CPWPR)

Terminal Functions

TERMINAL

NAME

PWP PACKAGE

TERMINAL NO.

GQE PACKAGE

TERMINAL NO.

1OUT

2

A3

1IN–

5

F1

1IN+

4

D1

2OUT

13

A7

2IN–

10

F9

2IN+

11

D9

VCC+

3, 12

B1, B9

VCC–

1, 14

A4, A6

NC

6, 7, 8 ,9

NA