TL061, TL061A, TL061B, TL061Y, TL062, TL062A

TL062B, TL062Y, TL064, TL064A, TL064B, TL064Y

LOW-POWER JFET-INPUT OPERATIONAL AMPLIFIERS

SLOS078F – NOVEMBER 1978 – REVISED JANUARY 1999

6

POST OFFICE BOX 655303

TL064Y chip information

This chip, when properly assembled, has characteristics similar to the TL064. Thermal compression or

ultrasonic bonding can be used on the doped-aluminum bonding pads. The chips can be mounted with

conductive epoxy or a gold-silicon preform.

Bonding-Pad Assignments

Chip Thickness: 15 Mils Typical

Bonding Pads: 4

× 4 Mils Minimum

TJ(max) = 150°C

Tolerances Are

±10%.

All Dimensions Are in Mils.

Pin (11) is Internally Connected

to Backside of Chip.

+

–

1OUT

1IN+

1IN–

VCC+

(4)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN+

2IN–

2OUT

(11)

VCC–

+

–

4OUT

4IN+

4IN–

(13)

(10)

(9)

(12)

(8)

–

+

(14)

3OUT

3IN+

3IN–

60

110

(13)

(14)

(1)

(2)

(3)

(5)

(6)

(7)

(8)

(9)

(10)

(12)

(11)

(4)