PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

5962-9096901M2A

ACTIVE

LCCC

FK

20

1

None

POST-PLATE

Level-NC-NC-NC

5962-9096901MCA

ACTIVE

CDIP

J

14

1

None

A42 SNPB

Level-NC-NC-NC

TLC3704CD

ACTIVE

SOIC

D

14

50

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC3704CDR

ACTIVE

SOIC

D

14

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC3704CN

ACTIVE

PDIP

N

14

25

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

TLC3704CNSR

ACTIVE

SO

NS

14

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC3704CPW

ACTIVE

TSSOP

PW

14

90

None

CU NIPDAU

Level-1-220C-UNLIM

TLC3704CPWLE

OBSOLETE

TSSOP

PW

14

None

Call TI

Call TI

TLC3704CPWR

ACTIVE

TSSOP

PW

14

2000

None

CU NIPDAU

Level-1-220C-UNLIM

TLC3704ID

ACTIVE

SOIC

D

14

50

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC3704IDR

ACTIVE

SOIC

D

14

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC3704IN

ACTIVE

PDIP

N

14

25

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

TLC3704IPW

ACTIVE

TSSOP

PW

14

90

None

CU NIPDAU

Level-1-220C-UNLIM

TLC3704IPWR

ACTIVE

TSSOP

PW

14

2000

None

CU NIPDAU

Level-1-220C-UNLIM

TLC3704MD

ACTIVE

SOIC

D

14

50

None

CU NIPDAU

Level-1-220C-UNLIM

TLC3704MDR

ACTIVE

SOIC

D

14

2500

None

CU NIPDAU

Level-1-220C-UNLIM

TLC3704MFKB

ACTIVE

LCCC

FK

20

1

None

POST-PLATE

Level-NC-NC-NC

TLC3704MJ

ACTIVE

CDIP

J

14

1

None

A42 SNPB

Level-NC-NC-NC

TLC3704MJB

ACTIVE

CDIP

J

14

1

None

A42 SNPB

Level-NC-NC-NC

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

PACKAGE OPTION ADDENDUM

www.ti.com

22-Feb-2005

Addendum-Page 1