TLC372, TLC372Q, TLC372Y

LinCMOS

™ DUAL DIFFERENTIAL COMPARATORS

SLCS114B – NOVEMBER 1983 – REVISED MARCH 1999

3

POST OFFICE BOX 655303

TLC372Y chip information

These chips, when properly assembled, display characteristics similar to the TLC372C. Thermal compression

or ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 3.6

× 3.6 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

1OUT

1IN +

1IN –

VCC +

(8)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN +

2IN –

2OUT

(4)

GND

57

57

(3)

(2)

(7)

(8)

(1)

(5)

(6)

(4)