TLE2227, TLE2227Y, TLE2237, TLE2237Y

EXCALIBUR LOW-NOISE HIGH-SPEED

PRECISION DUAL OPERATIONAL AMPLIFIERS

SLOS184 – FEBRUARY 1997

2

POST OFFICE BOX 655303

symbol (each amplifier)

+

–

OUT

IN +

IN –

TLE2227Y chip information

This chip, properly assembled, displays characteristics similar to the TLE2227C. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips my be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

+

–

1OUT

1IN +

1IN –

VCC+

(8)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN +

2IN –

2OUT

(4)

VCC–

116

104

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)