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TLE2082ACD Datasheet(PDF) 5 Page - Texas Instruments

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Part # TLE2082ACD
Description  EXCALIBUR HIGH-SPEED JFET-INPUT OPERATIONAL AMPLIFIERS
PDF  69 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLE2082ACD Datasheet(HTML) 5 Page - Texas Instruments

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TLE208x, TLE208xA, TLE208xY
EXCALIBUR HIGH-SPEED JFET-INPUT
OPERATIONAL AMPLIFIERS
SLOS182A – FEBRUARY 1997 – REVISED MARCH 2000
5
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLE2082Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2082. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
× 4 MINIMUM
TJmax = 150°C
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF THE CHIP.
+
–
1OUT
1IN +
1IN –
VCC+
(4)
(6)
(3)
(2)
(5)
(1)
(7)
(8)
–
+
2OUT
2IN +
2IN –
VCC–
80
90
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)



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