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TLV2361 Datasheet(PDF) 1 Page - Texas Instruments |
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TLV2361 Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 17 page ![]() TLV2361, TLV2361Y, TLV2362, TLV2362Y HIGH-PERFORMANCE LOW-VOLTAGE OPERATIONAL AMPLIFIERS SLOS195B – FEBRUARY 1997 – REVISED OCTOBER 1998 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Low Supply-Voltage Operation...VCC = ±1 V Min D Wide Bandwidth...7 MHz Typ at VCC± = ±2.5 V D High Slew Rate...3 V/µs Typ at VCC± = ±2.5 V D Wide Output Voltage Swing... ±2.4 V Typ at VCC± = ±2.5 V, RL = 10 kΩ D Low Noise...8 nV/√Hz Typ at f = 1 kHz D Package Options Include SOT-23 (DBV) Package for the TLV2361 and Plastic Small-Outline (D), Thin Shrink Small-Outline (PW), and Dual-In-Line (P) Packages for the TLV2362 description The TLV236x devices are high-performance dual operational amplifiers built using an original Texas Instruments bipolar process. These devices can be operated at a very low supply voltage ( ±1 V), while maintaining a wide output swing. The TLV236x devices offer a dramatically improved dynamic range of signal conditioning in low-voltage systems. The TLV236x devices also provide higher performance than other general-purpose operational amplifiers by combining higher unity-gain bandwidth and faster slew rate. With their low distortion and low-noise performance, these devices are well suited for audio applications. The C-suffix devices are characterized for operation from 0 °C to 70°C and the I-suffix devices are characterized for operation from –40 °C to 85°C. TLV2361 AVAILABLE OPTIONS PACKAGED DEVICES CHIP TA SOT-23 (DBV)† SYMBOL CHIP FORM‡ (Y) 0 °C to 70°C TLV2361CDBV VAAC TLV2361Y –40 °C to 85°C TLV2361IDBV VAAI † The DBV packages are only available taped and reeled. ‡ Chip forms are specified for operation at 25 °C only. TLV2362 AVAILABLE OPTIONS PACKAGED DEVICES CHIP TA SMALL OUTLINE§ (D) PLASTIC DIP (P) TSSOP¶ (PW) CHIP FORM‡ (Y) –20 °C to 85°C TLV2362ID TLV2362IP TLV2362IPWR TLV2362Y ‡ Chip forms are specified for operation at 25 °C only. § The D packages are available taped and reeled. Add an R to the package suffix (e.g., TLV2362IDR). ¶ The PW packages are available left-ended taped and reeled only, (e.g., TLV2362IPWR). Copyright © 1998, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 5 4 1 2 3 VCC+ OUT IN+ VCC– IN– 1 2 3 4 8 7 6 5 1OUT 1IN– 1IN+ VCC– VCC+ 2OUT 2IN– 2IN+ TLV2361 . . . DBV PACKAGE (TOP VIEW) TLV2362 . . . D, P, OR PW PACKAGE (TOP VIEW) |
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