TPS2330, TPS2331

SINGLE HOT SWAP POWER CONTROLLER WITH

CIRCUIT BREAKER AND POWER-GOOD REPORTING

SLVS277A – MARCH 2000– REVISED APRIL 2000

13

POST OFFICE BOX 655303

APPLICATION INFORMATION

typical application diagram

This diagram shows a typical dual hot-swap application. The pullup resistors at PWRGD and Fault should be

relatively large (e.g. 100 k

Ω) to reduce power loss unless they are required to drive a large load.

VREG

0.1

µF

IN

ISET

RISET

ISENSE

RSENSE

GATE DISCH

VSENSE

RVSENSE_TOP

RVSENSE_BOTTOM

+

FAULT

PWRGD

FAULT

PWRGD

TIMER

ENABLE

DGND

AGND

VO

ENABLE

1

µF ∼ 10 µF

3 V

∼ 13 V IN

TPS2331

System

Board

Figure 18. Typical Hot-Swap Application

input capacitor

A 0.1-

µF ceramic capacitor in parallel with a 1-µF ceramic capacitor should be placed on the input power

terminals near the connector on the hot-plug board to help stabilize the voltage rails on the cards. The

TPS2330/31 does not need to be mounted near the connector or these input capacitors. For applications with

more severe power environments, a 2.2-

µF or higher ceramic capacitor is recommended near the input

terminals of the hot-plug board. A bypass capacitor for IN should be placed close to the device.

output capacitor

A 0.1-

µF ceramic capacitor is recommended per load on the TPS2330/31; these capacitors should be placed

close to the external FETs and to TPS2330/31. A larger bulk capacitor on the load is also recommended. The

value of the bulk capacitor should be selected based on the power requirements and the transients generated

by the application.

external FET

To deliver power from the input sources to the loads, the controller needs an external N-channel MOSFET. A

few widely used MOSFETs are shown in Table 1. But many other MOSFETs on the market can also be used

with TPS23xx in hot-swap systems.