TPS6735

FIXED NEGATIVE 5-V 200-mA INVERTING DC/DC CONVERTER

SLVS141A – JULY 1996 – REVISED JANUARY 1997

3

POST OFFICE BOX 655303

chip information

These chips, when properly assembled, display characteristics similar to the TPS6735. Thermal compression

or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with

conductive epoxy or a gold-silicon preform.

75

82

88

8

1

2

3

45

5

TPS6735Y

(1)

(2)

(3)

(8)

(7)

(6)

EN

REF

SS

OUT

FB

VCC

GND

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJ max = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

6

7

7

(4)

(5)

COMP

Terminal Functions

TERMINAL

DESCRIPTION

NAME

NO.

DESCRIPTION

EN

1

Enable. EN > 2 V turns on the TPS6735. EN

≤ 0.4 V turns it off.

REF

2

1.22-V reference voltage output. REF can source 125

µA for external loads.

SS

3

Soft start. A capacitor between SS and GND brings the output voltage up slowly.

COMP

4

Compensation. A capacitor to ground stabilizes the feedback loop.

FB

5

Feedback. FB connects to the dc/dc converter output.

GND

6

Ground

OUT

7

Power MOSFET drain connection

VCC

8

Supply-voltage input