TMP112 datasheet(6/24 Pages) TI

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APPLICATION INFORMATION

TMP112

0.01mF

V+

GND

ALERT

(Output)

ADD0

SCL

SDA

Two-Wire

Controller

NOTE:SCL,SDA,andALERT

pinsrequirepull-upresistors.

Diode

Temp.

Sensor

A/D

Converter

OSC

Control

Logic

Serial

Interface

Config.

andTemp.

TMP112

Temperature

SCL

ALERT

SDA

GND

V+

ADD0

ALERT

Core

SCL

GND

V+

SDA

TMP112

SBOS473B – MARCH 2009 – REVISED JUNE 2009 ......................................................................................................................................................... www.ti.com

The TMP112 is a digital temperature sensor that is

Pull-up resistors are required on SCL, SDA, and

optimal

for

thermal-management

and

ALERT. A 0.01

µF bypass capacitor is recommended,

thermal-protection applications. A block diagram of

as shown in Figure 10.

the TMP112 is shown in Figure 8. The TMP112 is

two-wire- and SMBus interface-compatible, and is

specified over an operating temperature range of

–40°C to +125°C. Figure 9 illustrates the ESD

protection circuitry contained in the TMP112.

Figure 10. Typical Connections

The temperature sensor in the TMP112 is the chip

itself. Thermal paths run through the package leads

as well as the plastic package. The lower thermal

resistance of metal causes the leads to provide the

primary thermal path.

Figure 8. Internal Block Diagram

To maintain accuracy in applications that require air

or surface temperature measurement, care should be

taken to isolate the package and leads from ambient

air temperature. A thermally-conductive adhesive is

helpful in achieving accurate surface temperature

measurement.

Figure 9. Equivalent Internal ESD Circuitry

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