2

UCC5630A

ABSOLUTE MAXIMUM RATINGS

TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V

Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . 0V to TRMPWR

Package Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . 2W

Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . –55°C to +150°C

Lead Temperature (Soldering, 10sec.) . . . . . . . . . . . . . +300°C

All voltages are with respect to pin 18. Currents are positive

into, negative out of the specified terminal. Consult Packaging

Section of the Databook for thermal limitations and consider-

ations of packages.

RECOMMENDED OPERATING CONDITIONS

TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.25V

L3+

HS/GND

L9–

L9+

L8–

TRMPWR

N/C

N/C

HS/GND

L2–

HS/GND

L1+

L1–

L2+

REG

HS/GND

L3–

L8+

HS/GND

HS/GND

L4+

L4–

14

13

12

11

10

9

8

7

6

5

4

3

2

1

23

24

25

26

27

28

29

30

31

32

33

34

35

36

18

17

16

15

DIFF B

MSTR/SLV

DIFSENS

19

20

21

22

L5+

L5–

DISCNCT

GND

L7–

L7+

L6–

L6+

HIPD

LVD

SE

CONNECTION DIAGRAM

48

47

46

45

1

44

43

42

41

40

39

38

37

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

36

35

34

33

32

31

30

29

28

27

26

25

NC

L3+

L3–

L4+

L4–

HS/GND

GND

DISCNCT

L5+

HS/GND

HS/GND

L1+

L1–

L2+

L2–

NC

HS/GND

REG

NC

NC

TERMPWR

NC

LVD

HIPD

L8+

L8–

L9+

L9–

HS/GND

N/C

DIFFB

DIFSENS

L6+

HS/GND

L7+

L6–

L7–

HS/GND

HS/GND

HS/GND

L5–

HS/GND

HS/GND

SE

HS/GND

HS/GND

HS/GND

MSTR/SLV

LQFP-48 (Top View)

FQP Package

QSOP-36 (Top View)

MWP Package

Packaged Devices

0 C to 70°C

UCC5630AMWP

UCC5630AFQP

AVAILABLE OPTIONS