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SPECIAL FEATURES

 Zener characteristic with voltage snap–back

to protect against ESD hits

 High avalanche voltage, low leakage and low

capacitance avoid signal attenuation

 Compatible to all 5V logic families

 Space saving, low inductance TSOC surface

mount package

 On–chip 5

resistors for isolation at both

anode and cathode terminals

 Industrial temperature range

DS9503

ESD Protection Diode with Resistors

www.maxim-ic.com

SYMBOL AND CONVENTIONS

PACKAGE OUTLINE

VCA

A

IC

C

TSOC SURFACE MOUNT PACKAGE

6

1

5

2

4

3

TOP VIEW

SIDE VIEW

19-4699; 7/09

ORDERING INFORMATION

DS9503P+

6-lead TSOC package

DS9503P+T&R

6-lead TSOC package

+Denotes a lead(Pb)-free/RoHS-compliant package.

T&R = Tape and reel.

DESCRIPTION

This DS9503 is designed as an ESD protection device for 1–Wire MicroLAN interfaces. In contrast to the

DS9502, the DS9503 includes two 5

isolation resistors on chip. Although 5are negligible during

communication, they represent a high impedance relative to the conducting diode during an ESD event.

Thus, the diode absorbs the energy while the resistors further isolate and protect the circuit at the other

side of the package. If used with circuits that already have a strong ESD–protection at their I/O port, the

ESD protection level is raised to more that 27 kV (IEC 801–2 Reference model). In case of abnormal

ESD hits beyond its maximum ratings the DS9503 will eventually fail “short” thus preventing further

damage.

During normal operation the DS9503 behaves like a regular Zener Diode. When the voltage exceeds the

trigger voltage, the I/V characteristic of the device will “snapback” allowing the same or higher amount

of current to flow, but at a significantly lower voltage. As long as a minimum current or voltage is

maintained, the device will stay in the “snapback mode”. If the voltage or the current falls below the

holding voltage or holding current, the device will abruptly change to its normal mode and conduct only a

small leakage current.