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MAX9944 Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX9944
Description  High-Voltage, Precision, Low-Power Op Amps
PDF  15 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX9944 Datasheet(HTML) 2 Page - Maxim Integrated Products

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High-Voltage, Precision, Low-Power Op Amps
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Supply Voltage (VCC to VEE) ..................................-0.3V to +40V
All Other Pins (Note 1) .....................(VEE - 0.3V) to (VCC + 0.3V)
OUT Short-Circuit Current Duration
8-Pin µMAX (VCC - VEE ≤ 20V)...............................................3s
8-Pin µMAX (VCC - VEE > 20V) ................................Momentary
6-Pin TDFN (VCC - VEE ≤ 20V) .............................................60s
6-Pin TDFN (VCC - VEE > 20V)...............................................2s
8-Pin SO (VCC - VEE ≤ 20V) .................................................60s
8-Pin SO (VCC - VEE > 20V)...................................................2s
8-Pin TDFN (VCC - VEE ≤ 20V) .............................................60s
8-Pin TDFN (VCC - VEE > 20V)...............................................2s
Continuous Input Current (Any Pins) ................................±20mA
Thermal Limits (Note 2)
Multiple Layer PCB
Continuous Power Dissipation (TA = +70°C)
8-Pin µMAX (derate 4.8mW/°C above +70°C) ...........387.8mW
θJA.........................................................................206.3°C/W
θJC..............................................................................42°C/W
6-Pin TDFN-EP (derate 23.8mW/°C above +70°C) ..1904.8mW
θJA..............................................................................42°C/W
θJC................................................................................9°C/W
8-Pin SO (derate 7.6mW/°C above +70°C)...................606.1W
θJA............................................................................132°C/W
θJC..............................................................................38°C/W
8-Pin TDFN-EP (derate 24.4mW/°C above +70°C) ..1951.2mW
θJA..............................................................................41°C/W
θJC................................................................................8°C/W
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Operating Supply Voltage Range
VSUPPLY
Guaranteed by PSRR test
±3
±19
V
Quiescent Supply Current per
Amplifier
ICC
550
950
µA
Power-Supply Rejection Ratio
PSRR
VS =
±3V to ±19V
105
130
dB
TA = +25
°C
20
100
Input Offset Voltage
VOS
TA = -40
°C to +125°C
240
µV
Input Offset Voltage Drift
TCVOS
0.4
µV/
°C
VEE + 0.3V
≤ VCM ≤ VCC - 1.8V
4
20
Input Bias Current
IBIAS
VEE
≤ VCM ≤ VCC - 1.8V
90
nA
Input Offset Current
IOS
VEE
≤ VCM ≤ VCC - 1.8V
1
10
nA
Input Voltage Range
VIN+ , VIN-
Guaranteed by CMRR test,
TA = -40
°C to +125°C
VEE
VCC -
1.8
V
VEE + 0.3V
≤ VCM ≤ VCC - 1.8V
105
125
Common-Mode Rejection Ratio
CMRR
VEE
≤ VCM ≤ VCC - 1.8V
105
dB
ELECTRICAL CHARACTERISTICS
(VCC = 15V, VEE = -15V, VCM = 0, RL = 10kΩ to GND, GND = 0, TA = -40°C to +125°C. Typical values are at TA = +25°C, unless oth-
erwise noted.) (Note 3)
Note 1: Operation is limited by thermal limits.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.



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