MAX16822B datasheet(2/10 Pages) MAXIM

2 / 10 page

2MHz, High-Brightness LED Drivers with

Integrated MOSFET and High-Side Current Sense

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(VIN = +24V, VDIM = VIN, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, see www.maxim-ic.com/thermal-tutorial.

IN, CS, LX, DIM to GND .........................................-0.3V to +70V

TEMP_I to GND .......................................................-0.3V to +6V

PGND to GND ......................................................-0.3V to +0.3V

CS to IN .................................................................-0.3V to +0.3V

Maximum Current into Any Pin

(except IN, LX, and PGND).............................................20mA

Continuous Power Dissipation (TA = +70°C)

8-Pin SO (derate 7.4mW/°C above +70°C)...............588.2mW

Junction-to-Ambient Thermal Resistance (

θJA) (Note 1)...136°C/W

Pin-to-Pin ESD Ratings......................................................±2.5kV

Operating Temperature Range

350mA (max) Output Current ........................-40°C to +125°C

500mA (max) Output Current ........................-40°C to +105°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Input-Voltage Range

VIN

6.5

Ground Current

No switching

1.5

Supply Current

VDIM < 0.6V, VIN = 12V

350

μA

UNDERVOLTAGE LOCKOUT (UVLO)

VCS = VIN - 100mV, VIN rising from 4V

until VLX < 0.5VIN

6.25

6.5

Undervoltage Lockout

UVLO

VCS = VIN - 100mV, VIN falling from 6.5V

until VLX > 0.5VIN

Undervoltage-Lockout Hysteresis

0.5

SENSE COMPARATOR

MAX16822A, (VIN - VCS) rising from

140mV until VLX > 0.5VIN

201

210

216

Sense Voltage Threshold High

VSNSHI

MAX16822B, VIN - VCS rising from 140mV

until VLX > 0.5VIN

218

230

236

MAX16822A, VIN - VCS falling from

260mV until VLX < 0.5VIN

185

190

198

Sense Voltage Threshold Low

VSNSLO

MAX16822B, VIN - VCS falling from

260mV until VLX < 0.5VIN

166

170

180

Propagation Delay to Output High

tDPDH

Falling edge of VIN - VCS from 140mV to

260mV to VLX = 0.5VIN

Propagation Delay to Output Low

tDPDL

Rising edge of VCS - VIN from 260mV to

140mV to VLX < 0.5VIN

CS Input Current

ICSIN

VIN - VCS = 200mV

3.5

μA

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