ADXL327

Rev. 0 | Page 13 of 16

LAYOUT AND DESIGN RECOMMENDATIONS

The recommended soldering profile is shown in Figure 25, followed by a description of the profile features in Table 6. The recommended

PCB layout or solder land drawing is shown in Figure 26.

PREHEAT

CRITICAL ZONE

TIME

RAMP-DOWN

RAMP-UP

Figure 25. Recommended Soldering Profile

Table 6. Recommended Soldering Profile

Profile Feature

Sn63/Pb37

Pb-Free

3°C/sec maximum

3°C/sec maximum

Preheat

100°C

150°C

150°C

200°C

60 sec to 120 sec

60 sec to 180 sec

Ramp-Up Rate

3°C/sec maximum

3°C/sec maximum

183°C

217°C

60 sec to 150 sec

60 sec to 150 sec

240°C + 0°C/−5°C

260°C + 0°C/−5°C

10 sec to 30 sec

20 sec to 40 sec

Ramp-Down Rate

6°C/sec maximum

6°C/sec maximum

Time 25°C to Peak Temperature

6 minutes maximum

8 minutes maximum

CENTER PAD IS NOT

INTERNALLY CONNECTED

BUT SHOULD BE SOLDERED

FOR MECHANICAL INTEGRITY

0.50

MAX

0.65

0.325

1.95

0.65

0.325

4

4

0.35

MAX

1.95

DIMENSIONS SHOWN IN MILLIMETERS

Figure 26. Recommended PCB Layout