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MASW-007107 Datasheet(PDF) 3 Page - M/A-COM Technology Solutions, Inc. |
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MASW-007107 Datasheet(HTML) 3 Page - M/A-COM Technology Solutions, Inc. |
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3 / 4 page ![]() • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 3 GaAs Broadband SPDT Switch DC - 8.0 GHz Rev. V5 MASW-007107 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Die Bond Pad Configuration Pad No. Name Description 1 V C1 Voltage Control 1 2 RF1 RF Output 1 3 GND Ground 4 GND Ground 5 RF2 RF Output 2 6 V C2 Voltage Control 2 7 RFC RF Common Qualification Qualified to M/A-COM specification REL-201, Process Flow –2. Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be dam- aged by static electricity. Proper ESD control techniques should be used when handling these devices. Truth Table 15 Control VC1 Control VC2 RFC– RF1 RFC—RF2 1 0 On Off 0 1 Off On 15. 1 = +2.9 V to +5 V, 0 = 0 V + 0.2 V. Die Outline Drawing 11,12,13,14 11. Typical dimensions in inches (millimeters) 12. Die thickness is 0.006” (0.152 mm) 13. Typical bond pad is 0.003” square (0.076 mm square) 14. Bond pad metallization is gold. Die Size - Inches (mm) 0.022 x 0.0189 x 0.006 (0.56 x 0.48 x 0.152) Application Schematic C1, C2, C3 = 8pF |
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