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MASW-007107 Datasheet(PDF) 3 Page - M/A-COM Technology Solutions, Inc.

Part # MASW-007107
Description  GaAs Broadband SPDT Switch DC - 8.0 GHz
PDF  4 Pages
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

MASW-007107 Datasheet(HTML) 3 Page - M/A-COM Technology Solutions, Inc.

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• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
3
GaAs Broadband SPDT Switch
DC - 8.0 GHz
Rev. V5
MASW-007107
ADVANCED:
Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Die Bond Pad Configuration
Pad No.
Name
Description
1
V
C1
Voltage Control 1
2
RF1
RF Output 1
3
GND
Ground
4
GND
Ground
5
RF2
RF Output 2
6
V
C2
Voltage Control 2
7
RFC
RF Common
Qualification
Qualified to M/A-COM specification REL-201,
Process Flow –2.
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive
to electrostatic discharge (ESD) and can be dam-
aged by static electricity. Proper ESD control
techniques should be used when handling these
devices.
Truth Table
15
Control VC1 Control VC2
RFC– RF1
RFC—RF2
1
0
On
Off
0
1
Off
On
15. 1 = +2.9 V to +5 V, 0 = 0 V + 0.2 V.
Die Outline Drawing
11,12,13,14
11. Typical dimensions in inches (millimeters)
12. Die thickness is 0.006” (0.152 mm)
13. Typical bond pad is 0.003” square (0.076 mm square)
14. Bond pad metallization is gold.
Die Size - Inches (mm)
0.022 x 0.0189 x 0.006 (0.56 x 0.48 x 0.152)
Application Schematic
C1, C2, C3 = 8pF



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