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MA4GP905 Datasheet(PDF) 3 Page - M/A-COM Technology Solutions, Inc. |
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MA4GP905 Datasheet(HTML) 3 Page - M/A-COM Technology Solutions, Inc. |
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3 / 3 page ![]() • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 3 GaAs RoHS Compliant Beamlead PIN Diode Rev. V2 MA4GP905 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Handling and Assembly Procedures The following precautions should be observed to avoid damaging these devices. Cleanliness These devices should be handled in a clean environment. Static Sensitivity Aluminum Gallium Arsenide PIN diodes are Class 1 ESD sensitive and can be damaged by static electricity. Proper ESD techniques should be used when handling these devices. General Handling These devices have a polymer layer which provides scratch protection for the junction area and the anode air bridge. Beam lead devices must, however, be handled with extreme care since the leads may easily be distorted or broken by the normal pressures exerted when handled with tweezers. A vacuum pencil with a #27 tip is recommended for picking and placing. Attachment These devices were designed to be inserted onto hard or soft substrates. Recommended methods of attachment include thermo-compression bonding, parallel-gap welding and electrically conductive silver epoxy. See Application Note M541 page 8, Bonding and Handling and Procedures for Chip Diode Devices for more detailed assembly instructions. Ordering Information Part Number Packaging MA4GP905 Gel Pak |
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