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STM32F103C4H6ATR Datasheet(PDF) 66 Page - STMicroelectronics

Part # STM32F103C4H6ATR
Description  Low-density performance line, ARM-based 32-bit MCU with 16 or 32 KB Flash, USB, CAN, 6 timers, 2 ADCs, 6 communication interfaces
PDF  80 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F103C4H6ATR Datasheet(HTML) 66 Page - STMicroelectronics

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Electrical characteristics
STM32F103x4, STM32F103x6
66/80
Doc ID 15060 Rev 3
Figure 30.
Typical connection diagram using the ADC
1.
Refer to Table 45 for the values of RAIN, RADC and CADC.
2.
Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy
this, fADC should be reduced.
General PCB design guidelines
Power supply decoupling should be performed as shown inFigure 31 or Figure 32,
depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 31.
Power supply and reference decoupling (VREF+ not connected to VDDA)
1.
The VREF+ input is available only on the TFBGA64 package.
ai14150c
STM32F103xx
VDD
AINx
IL±1 µA
0.6 V
VT
RAIN(1)
Cparasitic
VAIN
0.6 V
VT
RADC(1)
12-bit
converter
CADC(1)
Sample and hold ADC
converter



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