MCP1703 datasheet(11/32 Pages) MICROCHIP

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DS22049D-page 11

MCP1703

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

MCP1703 PIN FUNCTION TABLE

3.1

Ground Terminal (GND)

Regulator ground. Tie GND to the negative side of the

output and the negative side of the input capacitor.

Only the LDO bias current (2.0 µA typical) flows out of

this pin; there is no high current. The LDO output

regulation is referenced to this pin. Minimize voltage

drops between this pin and the negative side of the

load.

3.2

Regulated Output Voltage (VOUT)

Connect VOUT to the positive side of the load and the

positive terminal of the output capacitor. The positive

side of the output capacitor should be physically

located as close to the LDO VOUT pin as is practical.

The current flowing out of this pin is equal to the DC

load current.

3.3

Unregulated Input Voltage (VIN)

Connect VIN to the input unregulated source voltage.

Like all low dropout linear regulators, low source

impedance is necessary for the stable operation of the

LDO. The amount of capacitance required to ensure

low source impedance will depend on the proximity of

the input source capacitors or battery type. For most

applications, 1 µF of capacitance will ensure stable

operation of the LDO circuit. For applications that have

load currents below 100 mA, the input capacitance

requirement can be lowered. The type of capacitor

used

can

ceramic,

tantalum,

aluminum

electrolytic. The low ESR characteristics of the ceramic

will yield better noise and PSRR performance at

high-frequency.

3.4

Exposed Thermal Pad (EP)

There is an internal electrical connection between the

Exposed Thermal Pad (EP) and the VSS pin; they must

be connected to the same potential on the Printed

Circuit Board (PCB).

Pin No.

2x3 DFN-8

Pin No.

SOT-223-3

Pin No.

SOT-23A

Pin No.

SOT-89-3

Name

Function

2,Tab

GND

Ground Terminal

323

VOUT

Regulated Voltage Output

2,Tab

VIN

Unregulated Supply Voltage

2, 3, 5, 6, 7

—

No Connection

—

Exposed Thermal Pad (EP); must be

connected to VSS.

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