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EDS-101993 Rev L
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
CGA-6618(Z)
Suggested Pad Layout
Package Drawing and Marking
Dimensions in inches (millimeters)
Refer to drawing posted at www.rfmd.com for tolerances.
Pin
Function
Description
1RF IN
Device 1. RF input pin. This pin requires the use of an external DC-blocking capacitor as shown in the schematic.
2, 3,
6, 7
GND
Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground leads as
possible.
4RF IN
Device 2. RF input pin. This pin requires the use of an external DC-blocking capacitor as shown in the schematic.
5RF OUT/VCC Device 2. RF output and bias pin. Bias should be supplied to this pin through an external series resistor and RF
choke inductor. Because DC biasing is present on this pin, a DC-blocking capacitor should be used in most appli-
cations. The supply side of the bias network should be well bypassed.
8RF OUT/VCC Device 1. Same as pin 5.
EPAD
GND
Exposed area on the bottom side of the package must be soldered to the ground plane of the board for optimum
thermal and RF performance. Several vias should be located under the EPAD as shown in the recommended
land pattern.
PCB Pad Layout
Dimensions in inches [millimeters]
Sized for 31 mil thick FR-4
Lot Code
CGA6618
.088 [2.25]
DETAIL A
.061 [1.549]
.155 [3.937]
.025
.013 [.33] x 45°
.008
.003 [.076]
SEATING PLANE
1
5
3
2
BOTTOM VIEW
.058 [1.473]
TOP VIEW
SIDE VIEW
END VIEW
PARTING LINE
.008 [.203]
4
6
7
8
.194 [4.93]
.061 [1.549]
.016 [.406]
.050 [1.27]
.194 [4.928]
5°
SEE DETAIL A
.236 [5.994]
.155 [3.937]
EXPOSED PAD
.112
[2.85]
PACKAGE TYPE:
ESOP-8
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