CSD16301Q2 datasheet(2/10 Pages) TI

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CSD16301Q2

SLPS235 – OCTOBER 2009.............................................................................................................................................................................................. www.ti.com

ELECTRICAL CHARACTERISTICS

TA = 25°C, unless otherwise specified

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Static Characteristics

BVDSS

Drain to Source Voltage

VGS = 0V, ID = 250μA

IDSS

Drain to Source Leakage Current

VGS = 0V, VDS = 20V

μA

IGSS

Gate to Source Leakage Current

VDS = 0V, VGS = +10/–8V

100

VGS(th)

Gate to Source Threshold Voltage

VDS = VGS, IDS = 250μA

0.9

1.1

1.4

VGS = 3V, IDS = 4A

Ω

RDS(on)

Drain to Source On Resistance

VGS = 4.5V, IDS = 4A

Ω

VGS = 8V, IDS = 4A

Ω

gfs

Transconductance

VDS = 15V, IDS = 4A

16.5

Dynamic Characteristics

CISS

Input Capacitance

260

340

COSS

Output Capacitance

VGS = 0V, VDS = 12.5V, f = 1MHz

165

215

CRSS

Reverse Transfer Capacitance

Series Gate Resistance

1.3

2.6

Ω

Gate Charge Total (4.5V)

2.8

Qgd

Gate Charge – Gate to Drain

0.4

VDS = 10V, IDS = 4A

Qgs

Gate Charge Gate to Source

0.6

Qg(th)

Gate Charge at Vth

0.3

QOSS

Output Charge

VDS = 12.5V, VGS = 0V

td(on)

Turn On Delay Time

2.7

Rise Time

4.4

VDS = 12.5V, VGS = 4.5V, IDS = 4A

RG = 2Ω

td(off)

Turn Off Delay Time

4.1

Fall Time

1.7

Diode Characteristics

VSD

Diode Forward Voltage

IDS = 4A, VGS = 0V

0.8

Qrr

Reverse Recovery Charge

VDD = 12.5V, IF = 4A, di/dt = 200A/μs

5.1

trr

Reverse Recovery Time

VDD = 12.5V, IF = 4A, di/dt = 200A/μs

THERMAL CHARACTERISTICS

TA = 25°C, unless otherwise specified

PARAMETER

MIN

TYP

MAX

UNIT

RθJC

Thermal Resistance Junction to Case(1)

8.4

°C/W

RθJA

Thermal Resistance Junction to Ambient(1) (2)

°C/W

(1)

RθJC is determined with the device mounted on a 1-inch

2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm ×

3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.

(2)

Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.

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