CPC1466

12

www.clare.com

R00B

3. Manufacturing Information

3.1 Mechanical Dimensions

3.1.1 SOIC

NOTES:

1. Coplanarity = 0.004 (0.1016) max.

2. Leadframe thickness does not include solder plating (1000 microinch maximum).

3. Sum of package height, standoff, and coplanarity does not exceed 0.083 (2.108).

inches

(mm)

DIMENSIONS

0.083 MAX

(2.108 MAX.)

SEE NOTE 3

0.350 TYP

(8.890 TYP.)

0.016 TYP

(0.406 TYP.)

LEAD TO PACKAGE STANDOFF:

MIN: 0.001 (0.0254)

MAX: 0.004 (0.102)

0.400±0.015

(10.160±0.381)

0.295±0.005

(7.493±0.127)

0.408±0.005

(10.363±0.127)

0.050 TYP

(1.270 TYP)

0.025 X 45˚

(0.635 X 45˚)

0.010 ±0.0005

(0.254 ±0.0127)

0.040 TYP

(1.016 TYP)

0.020±0.004

(0.508±0.1016)

PIN 1

PIN 16