Features

– 20 ns, 18 ns for AT68166F

– Standby: 13 mW (Typ)

– QML-Q or V with SMD 5962-06229

–ESCC

Note:

1. Only for AT68166F-18. 450mW for AT68166F-20.

Description

The AT68166F is a 16Mbit SRAM packaged in a hermetic Multi Chip Module

(MCM) for space applications.

The AT68166F MCM incorporates four 4Mbit AT60142FT SRAM dice. It can be orga-

nized as either one bank of 512Kx8, two banks of 512Kx16 or four banks of 512Kx8. It

combines rad-hard capabilities, a latch-up threshold of 80MeV.cm²/mg, a Multiple Bit

Upset immunity and a total dose tolerance of 300Krads, with a fast access time.

The MCM packaging technology allows a reduction of the PCB area by 50% with a

weight savings of 75% compared to four 4Mbit packages.

Thanks to the small size of the 4Mbit SRAM die, Atmel has been able to accommo-

date the assembly of the four dice on one side of the package which facilitates the

power dissipation.

The compatibility with other products allows designers to easily migrate to the Atmel

AT68166F memory.

The AT68166F is powered at 3.3V.

The AT68166F is processed according to the test methods of the latest revision of the

MIL-PRF-38535 or the ESCC 9000.

7747B–AERO–04/09

Rad Hard

16 MegaBit 3.3V

SRAM Multi-

Chip Module

AT68166F