 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
LTC3823IGNPBF Datasheet(PDF) 21 Page - Linear Technology |
|
|
|||||||||||||||||||||||||||||
LTC3823IGNPBF Datasheet(HTML) 21 Page - Linear Technology |
|
|
21 / 26 page  LTC3823 21 3823fd • Place CIN, COUT, MOSFETs, D1 and inductor all in one compact area. It may help to have some components on the bottom side of the board. • Use an immediate via to connect the components to ground plane including SGND and PGND of LTC3823. Use several bigger vias for power components. • Use compact plane for switch node (SW) to improve cooling of the MOSFETs and to keep EMI down. • Use planes for VIN and VOUT to maintain good voltage filtering and to keep power losses low. • Flood all unused areas on all layers with copper. Flooding with copper will reduce the temperature rise of power component. You can connect the copper areas to any DC net (VIN, VOUT, GND or to any other DC rail in your system). When laying out a printed circuit board, without a ground plane, use the following checklist to ensure proper opera- tion of the controller. 3823 F12 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 FCB RUN VON PGOOD VRNG VFB ITH SGND ION VDIFFOUT VOUTSENSE+ VOUTSENSE– TRACK/SS PLLFLTR GND PGOOD VRNG INTVCC VITH ION DIFFOUT FB TRACK/SS RUN Z0 BOOST TG SW SENSE+ SENSE– PGND BG INTVCC Z2 Z1/SSENABLE ZVCC VIN PLLIN LTC3823GN R6 7.5k R5 42.5k RON 100k R2 16.2k R1 5.11k RC 1.5k RPG 100k CC2 100pF CC1 6800pF C4 220pF CSS 0.1μF 1000pF 10k CVCC 4.7μF DB CMDSH-3 D1 B320A + COUT3 47μF X5R 3 COUT1 220μF 4V VOUT 2.5V 10A VIN 5V TO 28V + CIN 10μF 50V 3 CB 0.22μF R7 23.2k R8 27.1k M1 Si7342DP L1 1.2μH M2 Si7892ADP PLLIN + 0.01μF Figure 12. Design Example: 2.5V/7A at 320kHz • Segregate the signal and power grounds. All small- signal components should return to the SGND pin at one point which is then tied to the PGND pin close to the source of M2. • Place M2 as close to the controller as possible, keeping the PGND, BG and SW traces short. • Connect the input capacitor(s) CIN close to the power MOSFETs. This capacitor carries the MOSFET AC current. • Keep the high dV/dt SW, BOOST and TG nodes away from sensitive small-signal nodes. • Connect the INTVCC decoupling capacitor CVCC closely to the INTVCC and PGND pins. • Connect the top driver boost capacitor CB closely to the BOOST and SW pins. • Connect the VIN pin decoupling capacitor CIN closely to the VIN and PGND pins. APPLICATIONS INFORMATION |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
