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AP2111 Datasheet(PDF) 4 Page - Diodes Incorporated |
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AP2111 Datasheet(HTML) 4 Page - Diodes Incorporated |
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4 / 14 page ![]() AP2101/AP2111 2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2101/AP2111 Rev. 1 4 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated Electrical Characteristics (TA = 25°C, VIN = +5.0V, unless otherwise stated) Symbol Parameter Test Conditions (Note 4) Min Typ. Max Unit VUVLO Input UVLO Rload=1kΩ 1.6 1.9 2.5 V ISHDN Input Shutdown Current Disabled, IOUT= 0 0.5 1 μA IQ Input Quiescent Current Enabled, IOUT= 0 45 70 μA ILEAK Input Leakage Current Disabled, OUT grounded 1 μA IREV Reverse Leakage Current Disabled, VIN= 0V, VOUT= 5V, IREV at VIN 0.05 μA RDS(ON) Switch on-resistance VIN = 5V, IOUT= 1.5A TA = 25°C MSOP8-EP 90 115 m Ω SOP-8L 95 115 -40 °C ≤ T A ≤ 85°C 140 VIN = 3.3V, IOUT= 1.5A TA = 25°C 115 140 -40 °C ≤ T A ≤ 85°C 170 ILIMIT Over-Load Current Limit VIN= 5V, VOUT= 4.5V, CL=120μF 2.1 2.45 2.8 A ITrig Current limiting trigger threshold Output Current Slew rate (<100A/s) , CL=100μF 2.5 A ISHORT Short-Circuit Current Limit Enabled into short circuit, CL=100μF 2.5 A TSHORT Short-circuit Response Time VOUT = 0V to IOUT = ILIMIT (short applied to output) 5 μs VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V 0.8 V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 V ISINK EN Input leakage VEN = 5V 1 μA TD(ON) Output turn-on delay time CL=1μF, Rload=10Ω 50 μs TR Output turn-on rise time CL=1μF, Rload=10Ω 0.6 1.5 ms TD(OFF) Output turn-off delay time CL=1μF, Rload=10Ω 4 μs TF Output turn-off fall time CL=1μF, Rload=10Ω 0.03 0.1 ms RFLG FLG output FET on-resistance IFLG =10mA, CL=100μF 20 40 Ω TBlank FLG blanking time CIN=10μF, CL=100μF 4 7 15 ms RDIS Discharge resistance (Note 5) VIN = 5V, disabled, IOUT= 1mA 290 Ω TSHDN Thermal Shutdown Threshold Enabled, Rload=1kΩ 140 °C THYS Thermal Shutdown Hysteresis 25 °C θ JA Thermal Resistance Junction-to-Ambient SOP-8L (Note 6) 110 °C/W MSOP-8L-EP (Note 7) 60 °C/W Notes: 4. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 5. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path for the external storage capacitor. This is suitable only to discharge filter capacitors for limited time and cannot dissipate steady state currents greater than 8mA. 6. Test condition for SOP-8L: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout. 7. Test condition for MSOP-8L-EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. |
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