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LSRF9353 Datasheet(PDF) 5 Page - LIGITEK electronics co., ltd. |
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LSRF9353 Datasheet(HTML) 5 Page - LIGITEK electronics co., ltd. |
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5 / 7 page  Preheat 60 ~ 120 sec 120 150 5sec Time Reflow Temp/Time Rising +5 ℃/sec 220 Temp. ( ℃) Cooling -5 ℃/sec PART NO. LSRF9353 Soldering Iron: Basic spec is ≦5 sec when 260℃. If temperature is higher, time should be shorter(+10 ℃ → -1sec). Power dissipation of iron should be smaller than 15W,and temperature should be controllable. Surface temperature of the device should be under 230 ℃. Soldering heat 245 ±5℃ within 5 sec 120 ~ 180 sec Soldering heat Max. 260 ℃ Preheat 120 ~ 150 ℃ LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/6 |
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